In: Working Group Information

Last Updated: 15 March 2022

 In: Working Group Information 

PURPOSE

Creation of a process model for data management that is aligned with Automotive SPICE® 3.1 and other established standards in the industry.

MOTIVATION

Many of the current innovations in the automotive environment revolve around autonomous driving, digitization, connectivity, AI/machine learning, and new services in the context of mobility.

All of these innovations are based on the collection and use of data. However, the handling of data often plays a subordinate, barely visible role in today's development and operations processes, with corresponding risks.

The working group is creating a good practice framework that specifically addresses these risks; hence the working title "Data Management SPICE".

DELIVERABLES

• Pilot the draft model - we are actively looking for organizations interested in piloting.
• Create a Data Management SPICE PAM (aligned with Automotive SPICE® 3.1)
• Creation of standard training material and exams

MEMBERS

• Michael Neher
• Sascha Glasbrenner
• Niko Pollner
• Goekhan Oezdil
• Stefan Feser
• Tuexen Henning
• Dariusz Ziarniak
• Emrah Eminoglu
• Gerd Grest
• Turhan Batur
• Samer Sameh
• Gregor Pawelke
• Christina Stathatou

Working Group Leadership Team 

• Christian Hertneck (This email address is being protected from spambots. You need JavaScript enabled to view it.)
• Thomas Sievers (Head) (This email address is being protected from spambots. You need JavaScript enabled to view it.)

In: Working Group Information

Last Updated: 13 June 2018

Purpose and Goals

Creation of a process reference and assessment model for hardware development, which is

- compliant with ISO/330xx and ISO/IEC 15504-2

- aligned with Automotive SPICE® 3.1

- aligned with the VDA Automotive SPICE Guidelines

- aligned with ISO 26262-1:2018 2Ed and ISO 26262-5:2018 2Ed

Change requests for Automotive SPICE, e.g.

- SYS.3 does not mention “Producability”

- SYS processes does not address a production interface

- Thermal / environmental and EMC testing  Note for SYS.4/SYS.5  (testing)

Motivation

In the automotive industry, a significant no. or products are mechatronic products, i.e. comprising mechanical, electrical, electronial, electro-mechanical element, and software.

There is not Process Assessment Model yet providing indicators for all these product levels and aspects. Since Automotive SPICE v3.0, there is a "Plug-in" concept allowing for HW and mechanical lifecycle processes to be placed below the SYS.x, and beneath the SWE.x processes. Still, the VDA working group (AK) 13, at present, does not have the mandate to develop "MEE" and "HWE" process extensions.

As there is a ggworing need for companies to either assess hardware in isolation, or to assess mechatronic development processes, the goal of this working group is to propose such criteria.

Start and Deadlines

February 2018, projected finalization 4Q 2019

Constraints

This working group operates strictly according to teh intacs Guidelines for Kartellrecht.

Deliverables

ISO//IEC 330xx compliant Process Reference and Process Assessment Model

Contributors

• Pierre Metz (intacs, working group leader)
• Michael Glaser (Bosch)
• Michael Kaufmann (Bosch)
• Holger Göttel (Bosch)
• Sibylle Schmid (ZF)
• Christoper Sievers (Continental)
• Rajesh Ganij (WABCO)
• Gerd Vogler (Dräxlmaier)
• Claudia Balla (Dräxlmaier)
• Attila Fehervari (ART S.p.A.)
• Kosmas Kopmeier (SynSpace)
• Thomas Gabler (Kuglermaag)
• Michael Kaufmann

Working Group Leader

• Pierre Metz (intacs)

In: Working Group Information

Last Updated: 25 January 2022

Purpose

Creation of a process modell for mechanic development which is aligned with Automotive SPICE® 3.1 and other established standards in the industry.

Motivation

A significant part of the systemsdeveloped nowadays are mechantronic systems. These consist of mechanical,  electronical/electrical and software systems and/or components. To support company internal process improvement within companies it is useful to provide processes for mechnical, electronical/electrical, software and system development with the same base and structure. This also supports assessors in conducting SPICE assessments.

Deliverables

• Maintenance of SPICE Mechanical Engineering (an Automotive SPICE® 3.1 compliant process model)
• Creation of standard training material and exams

Members

• André Zeh
• Andrei Donciuc
• Carmen Bischof
• Daniel Brunnschweiler
• Giancinto Michele Schiraldi
• Hans Joachim Fach
• Holger Göttel
• Kai Rüdele
• Luben Krahtov
• Michael Salzer
• Rebecca Seith 
• Dr. Steffen Kuhl
• Timo Karasch

WorkGroup Leadship Team 

• Bernadette Bender
• Robert Schlieder (Head)

In: Working Group Information

Last Updated: 20 August 2021

Purpose

1. Defining and maintaining versioned procedures and forms
2. Publishing of those

Deliverables

1. Submitting procedures change proposal to the Advisory Board
2. Implementing changes

Members

• Ganji Rajesh (This email address is being protected from spambots. You need JavaScript enabled to view it.) (Head)
• Detlef Vohwinkel (This email address is being protected from spambots. You need JavaScript enabled to view it. )
• Christian Knüvener (This email address is being protected from spambots. You need JavaScript enabled to view it.)
• Bernhard Sechser (This email address is being protected from spambots. You need JavaScript enabled to view it. )