Working Group Hardware SPICE

PURPOSE / OBJECTIVE

Further development of a process reference and assessment model for hardware development, which is

• Compliant with ISO/330xx and ISO/IEC 15504-2
• Aligned with Automotive SPICE^® 4.0
• Aligned with the VDA Automotive SPICE Guidelines
• Aligned with ISO 26262-1:2018 2Ed and ISO 26262-5:2018 2Ed

Change requests for Automotive SPICE^®, e.g.

• SYS.3 does not mention “Producability”
• SYS processes do not address a production interface
• Thermal / environmental and EMC testing - Note for SYS.4/SYS.5  (testing)

MOTIVATION

In the automotive industry, a significant number of products are mechatronic, i.e., they comprise mechanical, electrical, electronic, electromechanical elements, and software.

There is currently no Process Assessment Model that provides indicators for all these product levels and aspects. Since Automotive SPICE^® v3.0, there is a "Extension" concept that allows hardware and mechanical lifecycle processes to be placed below the SYS.x, and beneath the SWE.x processes. Still, the VDA Working Group (AK) 13, at present, does not have the mandate to develop extensions for the "MEE" and "HWE" processes.

As there is a growing need for companies to either assess hardware in isolation or to assess mechatronic development processes, the goal of this working group is to propose such criteria.

START AND DEADLINES

February 2018, projected further development ongoing

CONSTRAINTS

This working group operates strictly according to the iNTACS Guidelines for Competition Law Guidelines.

DELIVERABLES

Upgraded ISO/IEC 330xx compliant Process Reference and Process Assessment Model

CONTRIBUTORS

WORKING GROUP LEADER

 Attila Fehérvári (This email address is being protected from spambots. You need JavaScript enabled to view it.)